Despite some pull back in the market recently, chip stock Advanced Micro Devices, Inc (NYSE: AMD) has largely held up as have Intel Corporation (NASDAQ: INTC) and NVIDIA Corporation (NASDAQ: NVDA). I should�mention that we recently had�an open position in Advanced Micro Devices in�our SmallCap Network Elite Opportunity (SCN EO) portfolio from last summer up until�late January when we locked in a small loss.�We decided to�get out�in part because it�� a trading portfolio and also because�AMD�� shares sank�once�more�after�the company�had issued an�earnings report���a repeat of what happened after three�previous earnings reports. Nevertheless and if you are an investor with a long term time horizon, you might want to consider the following news:
What Tech Sell Off? In a recent CNBC segment, it was noted that despite the recent selloff in the broader tech space, semiconductor companies specializing in chips that power devices like smartphones and tablets have held up well. Some of the big winners since early March include Intel, Advanced Micro Devices, Taiwan Semiconductor and Freescale Semiconductors, which are up better than 7% as�these companies are benefiting from a shift in the tech sector and the stabilization of the PC market (according to Chad Morganlander with Stifel Nicolaus). World�� Fastest Graphics Card Launched. On Tuesday, Advanced Micro Devices announced the�launch of the world's fastest and most powerful graphics card - the�AMD Radeon��R9 295X2. Forbes already has a detailed review, which concluded by saying:What I know for certain is that AMD�� Radeon 295X2 is a compelling product, and that it justifies its asking price in performance, thermals, and aesthetics. And I hope it signals a bold new direction for AMD in terms of design language and branding. Quite simply, if you��e not married to Nvidia�� robust ecosystem and want a 4K-capable card that stays cool and quiet, you can�� go wrong with the Radeon R9 295X2.
Hot Growth Companies To Buy For 2015: Intermolecular Inc (IMI)
Intermolecular, Inc. (Intermolecular), incorporated on June 16, 2004, is engaged in research and development and time-to-market for the semiconductor and clean-energy industries. The Company, through paid collaborative development programs (CDPs) with its customers, develops technology and intellectual property (IP) for its customers focused on advanced materials, processes, integration and device architectures. The Company provides its customers with technology through various fee arrangements and grants them rights to associated IP, primarily through royalty-bearing licenses. Through paid CDPs and its own development, the Company has established a portfolio of greater than 1,000 patents and patent applications. Its approach is broadly applicable to high-volume integrated device markets, which include the markets for semiconductors, flat glass coatings and glass-based devices, solar cells, light-emitting diodes (LEDs), flat-panel displays, advanced batteries and other energy efficiency applications.
As of December 31, 2012, the Company targets large, high-volume semiconductor and high-growth emerging clean energy markets, including DRAM, non-volatile memory (including flash memory and embedded memory), complex logic, flat glass coatings and glass-based devices, solar cells, LEDs and other energy efficiency applications. The Company�� customers include ATMI, Inc. (ATMI), Elpida Memory, Inc. (Elpida), First Solar. Inc. (First), GLOBALFOUNDRIES Singapore Pte. Ltd (GLOBALFOUNDRIES), Guardian Industries Corp. (Guardian), SanDisk Corporation (SanDisk), Taiwan Semiconductor Manufacturing Company (TSMC) and Toshiba Corporation (Toshiba). For the year ended December 31, 2012, the Company has received the majority of its revenue from customers in DRAM, flash memory, complex logic and energy-efficient applications in flat glass. The elements in HPC platform include Tempus HPC processing, automated characterization, and informatics and analysis software. Tempus HPC processing are used to process ! different experiments consisting of combinations of materials, processing parameters, sequencing and device structures. Automated characterization systems are used to characterize the substrates processed by its Tempus HPC processing tools. Informatics and analysis software are used to automate experiment generation, characterization, data analysis and reporting.
The Company�� HPC platform consists of its Tempus HPC processing tools, automated characterization and informatics and analysis software. The Company�� platform is purpose-built for Research and Development (R and D) using combinatorial process systems. Combinatorial processing is a methodology for discovery and development that employs parallel and other high-throughput experimentation, which allows R and D experimentation to be performed at speeds up to 100 times faster than traditional methods. The Company�� processing tools allows performing up to 192 experiments on a single substrate.
Advisors' Opinion:- [By Sofia Horta e Costa]
ARM Holdings Plc (ARM) lost 2.6 percent, leading European technology companies lower before it publishes half-year results next week. IMI Plc (IMI) gained 2 percent as Citigroup Inc. listed the engineering company among its most preferred stocks.
- [By Jake L'Ecuyer]
Leading and Lagging Sectors
Technology shares gained about 0.68 percent in today's trading. Meanwhile, top gainers in the sector included Intermolecular (NASDAQ: IMI), up 38.3 percent, and Infinera (NASDAQ: INFN), up 9.4 percent. In trading on Monday, utilities shares were relative laggards, down on the day by about 0.68 percent.
5 Best Semiconductor Stocks To Watch Right Now: Texas Instruments Incorporated(TXN)
Texas Instruments Incorporated engages in the design and sale of semiconductors to electronics designers and manufacturers worldwide. The company?s Analog segment offers high-performance analog products comprising standard analog semiconductors, such as amplifiers, data converters, and interface semiconductors; high-volume analog and logic products; and power management semiconductors and line-powered systems. Its Embedded Processing segment includes DSPs that perform mathematical computations to process and enhance digital data; and microcontrollers, which are designed to control a set of specific tasks for electronic equipment. The company?s Wireless segment designs, manufactures, and sells application processors and connectivity products. Its Other segment offers smaller semiconductor products, which include DLP products that are primarily used in projectors to create high-definition images; and application-specific integrated circuits. This segment also provides handhe ld graphing and scientific calculators, as well as licenses technologies to other electronic companies. The company serves the communications, computing, industrial, consumer electronics, automotive, and education sectors. Texas Instruments Incorporated sells its products through a direct sales force, distributors, and third-party sales representatives. It has collaboration agreements with PLX Technology Inc.; Neonode, Inc.; and Ubiquisys Ltd. The company was founded in 1938 and is headquartered in Dallas, Texas.
Advisors' Opinion:- [By Lee Jackson]
Texas Instruments Inc. (NASDAQ: TXN) also supplies VOIP chips to Cisco, but their sales to the company amount to a very small percentage which is not expected to hurt overall performance. The consensus price target for the venerable tech company is $38. Shareholders are paid a 2.9% dividend.
- [By Tim Beyers]
But investing is also a game best played in context. How does Intel stock compare to peers Advanced Micro Devices (NYSE: AMD ) and Texas Instruments (NASDAQ: TXN ) ? Here's what the numbers say:
- [By Rich Smith]
LSI is cheaper than it looks
When you stack up LSI stock against a couple of its larger competitors -- Marvell Technology (NASDAQ: MRVL ) and Texas Instruments (NASDAQ: TXN ) , it's not immediately clear that LSI is a bargain. Right off the bat, you can see that the stock sells for 30 times earnings -- while TI costs only 23.3 times earnings, and Marvell costs an even 22.0. - [By Diane Alter]
Dividend Stocks That Increased Payout in September
Accenture plc (NYSE: ACN) announced a 14.8%, or $0.12 per share, increase to its semiannual dividend. The management consulting firm will now pay a semiannual dividend of $0.93. Shares yield 2.53%. Agruim Inc. (NYSE: AGU) boosted its dividend by $1.00 per share to a total dividend of $3.00 on an annualized basis. Shares of the global retailer of agricultural products now sprout a 3.54% yield. Air Industries Group Inc. (NYSE: AIRI) doubled its dividend to $0.125 per share. The maker of airplane and helicopter parts now floats a lofty yield of 6.6%. Alexandria Real Estate Equities Inc. (NYSE: ARE) upped its dividend 4.6% to $0.68 per quarter for a yield of 4.21%. Banner Corp. (Nasdaq: BANR) boosted its quarterly dividend 25% to $0.15 per share. The parent company of Banner and Islander Bank serves the Pacific Northwest region. Brady Corp. (NYSE: BRC) lifted its quarterly dividend 2.6% to $0.78 per share. It was the 28th straight dividend increase from the identification solutions company. Shares yield 2.57%. Campbell Soup Co. (NSE: CPB) raised its quarterly dividend to $0.31 per share, up from $0.29. The company last raised its dividend in November 2010. Shares yield a hearty 3.06%. CLARCOR Inc. (NYSE: CLC) raised its quarterly dividend 26% to $0.17 per share. It's the largest percentage increase from the Tennessee-based diversified marketer of mobile filtration and packaging products in the last 20 years, and it continues the company's consecutive streak of increasing dividends for the last 30 years. Franklin Resources Inc. (NYSE: BEN) boosted its quarterly dividend 2.6% to $0.10 per share. Frisch's Restaurants Inc. (NYSE: FRS) increased its quarterly dividend 12.5% to $0.18. Shares yield 3.10% The Goodyear Tire & Rubber Company (NYSE: GT), in a move that suggests good times are ahead, reinstated its dividend at $0.05 per share. Good
5 Best Semiconductor Stocks To Watch Right Now: Advanced Semiconductor Engineering Inc (ASX)
Advanced Semiconductor Engineering, Inc. is principally engaged in the manufacture, assembly, processing, testing and distribution of integrated circuits (ICs). The Company provides semiconductor packaging and testing services, including plastic leaded chip carriers (PLCCs), quad flat packages (QFPs) and flip chip packaging technology, among others, which are applied in the manufacture of household electrical appliances, communication devices, automobile components, personal computers, set top boxes, servers, memory integrated circuits (ICs), mobile phones, digital cameras, game consoles, projectors, high definition (HD) televisions, wireless communication network products and power management ICs, among others. The Company operates its businesses primarily in Taiwan, Europe and the Americas. In August 2010, the Company acquired a 100% interest in EEMS Test Singapore.
The Company is focused on packaging and testing logic semiconductors. The Company offers its customers turnkey services, which consist of packaging, testing and direct shipment of semiconductors to end users designated by its customers. The Company�� global base of over 200 customers includes semiconductor companies across a range of end use applications, including Altera Corporation, ATI Technologies, Inc., Broadcom Corporation, Cambridge Silicon Radio Limited and Microsoft Corporation. During the year ended December 31, 2008, the Company�� packaging revenues accounted for 77.7% of its net revenues and its testing revenues accounted for 20.1% of its net revenues.
Packaging Services
The Company offers a range of package types to meet the requirements of its customers, with a focus on packaging solutions. Within its portfolio of package types, the Company focuses on the packaging of semiconductors. These include advanced leadframe-based package types, such as quad flat package, thin quad flat package, bump chip carrier and quad flat no-lead package, and package types based on substrates, such a! s flip-chip ball grid array (BGA) and other BGA types, as well as other packages, such as wafer-bumping products. Leadframe-based packages are packaged by connecting the die, using wire bonders, to the leadframe with gold wire. The Company�� leadframe-based packages include quad flat package (QFP)/ thin quad flat package (TQFP), quad flat no-lead package (QFN)/microchip carrier (MCC), advanced quad flat no-lead package (AQFN), bump chip carrier (BCC), small outline plastic package (SOP)/thin small outline plastic package (TSOP), small outline plastic j-bend package (SOJ), plastic leaded chip carrier (PLCC) and plastic dual in-line package (PDIP). Substrate-based packages employ the BGA design, which utilizes a substrate rather than a leadframe. It also assembles system-in-a-package products, which involve the integration of more than one chip into the same package. The Company�� substrate-based packages include Plastic BGA, Cavity Down BGA, Stacked-Die BGA, Flip-Chip BGA and land grid array (LGA).
The Company�� wafer-level packaging products include wafer level chip scale package (aCSP) and advanced wafer level package (aWLP). The Company offers module assembly services, which combine one or more packaged semiconductors with other components in an integrated module to enable functionality, typically using surface mount technology (SMT) machines and other machinery and equipment for system-level assembly. End use applications for modules include cellular phones, personal digital assistant (PDAs), wireless local area network (LAN) applications, bluetooth applications, camera modules, automotive applications and toys.
The Company provides module assembly services primarily at its facilities in Korea for radio frequency and power amplifier modules used in wireless communications and automotive applications. Interconnect materials connect the input/output on the semiconductor dies to the printed circuit board. Interconnect materials include substrate, which is a multi-layer m! iniature ! printed circuit board. The Company produces substrates for use in its packaging operations.
Testing Services
The Company provides a range of semiconductor testing services, including front-end engineering testing, wafer probing, final testing of logic/mixed-signal/radio frequency (RF) and memory semiconductors and other test-related services. The Company provides front-end engineering testing services, including customized software development, electrical design validation, and reliability and failure analysis. The Company provides final testing services for a variety of memory products, such as static random access memory (SRAM), dynamic random access memory (DRAM), single-bit erasable programmable read-only memory semiconductors and flash memory semiconductors.
The Company provides a range of additional test-related services, including burn-in testing, module sip testing, dry pack, tape and reel, and electric interface board and mechanical test tool design. The Company offers drop shipment services for shipment of semiconductors directly to end users designated by its customers.
Advisors' Opinion:- [By Jeff Reeves]
Advanced Semiconductor Engineering�(ASX) builds and distributes integrated circuits and other electronics. It�� not as sexy as some mobile chipmakers, but thankfully it doesn�� have to be — ASX is simply capitalizing on the general demand for microchips in everything from cars to computers to TVs.
- [By Namitha Jagadeesh]
The FTSE 100 Index (UKX) fell 1.31 points, less than 0.1 percent, to 6,679.77 at 10:12 a.m. in London, trimming an earlier decline of as much as 0.6 percent. The gauge has climbed 13 percent this year as central banks maintained stimulus measures to support the global economy. The broader FTSE All-Share Index (ASX) was also little changed today, while Ireland�� ISEQ Index retreated 0.3 percent.
- [By Jeff Reeves]
Next Page
Best Stocks to Buy for Around $5: Advanced Semiconductor Engineering (ASX)Advanced Semiconductor Engineering�(ASX) builds and distributes integrated circuits and other electronics. While that�� not as sexy as other chipmakers that play to mobile, it�� still a good business, considering the general demand for microchips in everything from cars to computers to TVs.
- [By Seth Jayson]
Advanced Semiconductor Engineering (NYSE: ASX ) is expected to report Q2 earnings around July 7. Here's what Wall Street wants to see:
5 Best Semiconductor Stocks To Watch Right Now: Camtek Ltd (CAMT)
Camtek Ltd. (Camtek), incorporated in 1987, designs, develops, manufactures and markets automated solutions dedicated for enhancing production processes and yield for the semiconductor manufacturing and packaging and the printed circuit board (PCB) and integrated circuit (IC) substrate industries. Camtek also designs, develops, manufactures and markets automated optical inspection (AOI), systems and related products. The Company�� AOI systems are used to enhance both production processes and yields for manufacturers in the semiconductor manufacturing and packaging industry and PCB and IC Substrate industry. Through the acquisition of Printar's assets, it also engaged in developing, manufacturing, sale and marketing of direct digital material deposition systems and inks for the PCB industry, with two major fields of activity: Solder Mask and Legend. In addition, through the acquisition of Sela, it is also engaged in the development, manufacturing and marketing of automated scanning electron microscope (SEM) and transmission electron microscope (TEM) sample preparation equipment, primarily for the semiconductor industry.
As of December 31, 2011, the Company had sold more than 2,500 AOI systems in 34 countries worldwide. The Company's PCB customer base includes the majority of the 100 PCB manufacturers worldwide. As of December 31, 2011, it had sold over 300 Falcon systems to more than 25 semiconductor manufacturers, among them outsourced semiconductor assembly and test (OSAT), integrated device manufacturers (IDM) and wafer level packaging subcontractors, including eight out of the top 10 semiconductors companies.
Camtek�� AOI systems consist of an electro-optical assembly unit, either movable or fixed, which consists of a video camera, precision optics and illumination sources. The electro-optical unit captures the image of the inspected product; a precise, either movable or fixed table, that holds the inspected product, and an electronic hardware unit, which operates the! entire system and includes embedded components that process and analyze the captured image by using its algorithms. Its systems can also compile and communicate statistical reports of inspection findings through the customer�� factory information system. The Company offers a range of systems for automated optical inspection of semiconductor wafers, IC substrates and PCBs. These systems are used to enhance production yields and assist in controlling manufacturing processes at wafer fabrication, test and assembly houses, and PCB plants worldwide.
The Company�� Falcon systems are designed for the back end market of the semiconductor industry. The Falcon�� advanced algorithms and inspection capabilities enable its dedicated models to detect defects in the die, which, if left undetected, may cause failure. The Condor is designed to meet the current and future inspection needs of the semiconductor industry. The Condor, through algorithms and advanced hardware configuration, is designed to enhance two dimensional (2D) and three dimensional (3D) detection abilities and increased throughput. The Condor family includes models for: 3D and 2D metrology and inspection of bumped-wafer prepared for packaging in the flip-chip technology; 2D metrology and inspection of finished wafers at the end of their manufacturing process and in test houses; Post-dicing inspection of frame-mounted wafers at assembly and packaging facilities, where it adds the value of detecting dicing-related damage, and inspection and metrology of micro-electro mechanical systems (MEMS) and other special applications.
Condor 5LED is an AOI system designed to provide solutions to a range of requirements that are to light emitting diode (LED) semiconductor manufacturers. The LED market�� special inspection requirements are characterized by 3-6 inch wafers, each of which may contain between 100 to over 200 thousand LED devices per wafer. Typically, the wafer is made of a translucent compound semiconductor, such as g! allium ar! senide, gallium phosphide and/or indium phosphide. The Gannet system is designed for the front end market of the semiconductor industry.
The Company�� AOI products for this industry consist of five product lines: the Phoenix, Dragon and Orion for the inspection of inner and outer layers of PCB panels and ultra-fine-line IC substrate; large area masks (LAM) dedicated for inspection of artwork; and the Pegasus for final inspection (AFI) of IC substrates and high density interconnect (HDI) panels. The Phoenix product family, introduced in November 2011, is designed to support a range of the demanding PCB and IC substrate applications, while keeping in pace with the dynamic technology changes in the industry. The Phoenix product family is enhanced with Spark - Camtek's and detection engine providing high detection capabilities, while minimizing false calls.
Dragon systems are high-throughput, automation-ready systems for inspection of all PCB types in a mass production environment. Dragon models are optimized for specific PCB technology ranges - from mainstream circuits of typically 100 (microns) conductor line width, up to high density substrates having 12 (microns) wide conductive lines. All Dragon models are designed to interface with automated material handling mechanisms provided by the Company or other automation suppliers. Orion systems are stand-alone AOI systems for high volume inspection of all PCB types designed to operate in inspectify mode of operation. Inspectify is a mode of operation enabling the operator to perform verification immediately after inspection on the same system, thus saving time and eliminating handling-related defects.
LAM is specially designed for main-stream LAM inspection. It offers unparalleled detection ability on LAM with down to 25 (microns) line/space width technology. The LAM incorporates advanced technology innovations to ensure the level of detection that these masks require at this critical production stage. Camtek offers! various ! stand-alone verification systems that enable verification of panels after inspection. The Pegasus line includes systems for automated inspection of finished IC substrates that are subsequently used in packaging of ball grid array (BGA) and Chip Scale Package (CSP) devices. The Pegasus inspects both sides of the substrate, detecting process and mechanical defects, in particular in the gold-plated areas, where the substrate will interconnect with the silicon die or the PCB, and in the solder-mask areas. Pegasus models handle substrates in strip format in magazines.
GreenJet is a SM digital printing system aimed to replace the conventional SM application lines for prototypes and high mix low volume production. The GreenJet system offers manufacturers flexible and digital SM printing technology solution. The LGP system incorporates PCB digital legend printing technologies with specially developed heat curable ink, resulting in output and system performance. Camtek has developed the inks for both LGP and GreenJet, which involves different chemicals mixed together in order to reach the required ink characterization.
The Company competes with Rudolph Technologies Inc., KLA-Tencor Corporation, Topcon Corporation, Toray Industries, Inc., Hitachi Ltd., Nidec Tosok Corporation., FEI Company, SII Nanotechnology Japan, Carl Zeiss, Inc., Orbotech Ltd., Dainippon Screen Manufacturing Company, Lloyd-Doyle Limited, Gigavis Co. Ltd., ATI Electronics Pty Ltd., Shirai Electronics Industrial Co. Ltd., First EIE SA and MicroCraft K.K.
Advisors' Opinion:- [By Bryan Murphy]
It's fun to be right, but it's also important to be right in a sustainable way. Otherwise, what's the point? While it remains to be seen if yours truly was right regarding his call last week on Camtek LTD. (NASDAQ:CAMT) [it's not looking ideal], it's worth another look at CAMT, if only to see how much progress has been made and what needs to happen now.
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